A316-HF-I2S-V1 USB TO I2S HiFi Audio Converter Evaluation Board Specification
1. Product Introduction 1.1 Product Description A316-HF-I2S-V1 is designed based on the A316-Mini--V1 XU316 module, with DAC removed , focusing on USB digital signal reception and conversion A316-HF-I2S-V1 receives 2-channel USB input and outputs via I2S after decoding. All pins of XU316 are brought out on the evaluation board, allowing users to perform various development and debugging on XU316. A316-HF-I2S-V1 includes 2 low phase noise 45.1584MHz/49.152MHz active crystals Combined with different DACs, users can evaluate various USB HiFi applications with this board, suitable for audio device developers and Hi-Fi DIY enthusiasts to build high-fidelity audio decoding systems 1.2 Product Features USB Interface Features USB 2.0 (Full-speed and High-speed) USB Audio Class 1.0 USB Audio Class 2.0 USB Firmware Upgrade (DFU) 1.3 Specifications Specification Item Description Product Name A316-HF-I2S-V1 Product Description USB TO I2S HiFi Audio Converter Evaluation Board Specification Core Chip XMOS XU316-1024-QF60B-C24 Clock 48.152MHz/49.152MHz Active Crystal Clock Package Type Pin Header Environmental Statement All hardware components fully comply with EU RoHS Directive
1.4 Absolute Electrical Parameters Parameter Minimum Maximum Unit Storage Temperature -40 125 °C Supply Voltage -0.5 5.63 V ESD Voltage (Human Model) TAMB-25°C -2 2 KV ESD Voltage (Machine Model) TAMB-25°C -500 500 V
1.5 Normal Operating Conditions Function Minimum Typical Maximum Unit Operating Temperature 0 - 70 °C Operating Voltage 4.95 5.0 5.63 V
1.6 Operating Current Operating Status Average Peak Unit Active@5V 90 150 mA
2. Pin Definitions 2.1 Pin Layout 2.2 Pin Description Audio Output Interface No. Name Type Function 1 3.3V P Outputs 3.3V high level when USB cable is inserted 2 XOD00 I/O I2C CLK 3 DATA I/O I2S(Master) DATA 4 BCLK I/O I2S(Master) BCLK 5 LRCK I/O I2S(Master) LRCK 6 MCLK I/O I2S(Master) MCLK, 49.152Mhz or 45.1584Mhz 7 DSDOE I/O Outputs 3.3V high level when DSD stream is detected 8 GND P Ground 9 3V3 P 3.3V power output 10 3V3 P 3.3V power output 11 XOD30 I/O DAC MUTE, outputs high level during sampling rate change or DSD mode change 12 X0D11 I/O I2C DATA 13 GND P Ground 14 GND P Ground 15 GND P Ground 16 X1D00 I/O Multi-function GPIO 17 X0D40 I/O Multi-function GPIO 18 X0D41 I/O Multi-function GPIO 19 X0D42 I/O Multi-function GPIO 20 X0D43 I/O Multi-function GPIO
Expansion Interface 1 No. Name Type Function 1 X1D16 I/O Multi-function GPIO 2 X1D18 I/O Multi-function GPIO 3 X1D22 I/O Multi-function GPIO 4 X0D37 I/O Multi-function GPIO 5 X1D13 I/O Multi-function GPIO 6 X1D17 I/O Multi-function GPIO 7 X1D19 I/O Multi-function GPIO 8 GND P Ground
Expansion Interface 2 No. Name Type Function 1 X1D11 I/O Module clock divider output 2 X1D09 I/O Module clock divider output 3 X1D34 I/O Module clock divider output 4 MCLK/2 I/O MCLK/2 24.576Mhz or 22.5792Mhz 5 X1D10 I/O Module clock divider output 6 X1D01 I/O Module clock divider output 7 X0D31 I/O Module clock divider output 4 GND P Ground
Expansion Interface 3 No. Name Type Function 1 GND P Module ground 2 X0D33 I/O Multi-function GPIO 3 X0D32 I/O Multi-function GPIO 4 X0D39 I/O Multi-function GPIO
DEBUG Interface No. Name Type Function 1 GND P Module ground 2 1.8V P 1.8V power supply 3 TCK I Test clock 4 TDO I/O Test data output 5 0.9V P 0.9V power supply 6 RST I Reset signal 7 TMS I/O Test mode selection 8 TDI I/O Test data input
3. Module Dimensions and PCB Package Diagram 3.1 Module Dimensions PCB Dimensions: 68±0.3(L)X31±0.3(W)X1.6±0.1(H)
3.2 Module Package Diagram Tray + Outer Box Packaging
5. Recommended Reflow Temperature Profile 6. Revision History Version Date Description Revised by V1.0 2025-05-07 Initial Release
