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A316-1926-V1¶
USB HiFi Decoder Dedicated XU316 Module with Integrated 45.158MHz and 49.152MHz Active Crystals
1. Product Overview¶
1.1 Product Description¶
- A316-1926V1 is a USB multi-channel high-definition audio decoder module. The module uses XMOS XU316-1024-QF60BC24 chip and integrates a high-precision DC-DC chip that outputs 1.8V and 0.9V to power the XU316. The module integrates 45.158MHz and 49.152MHz active crystals to meet different high-definition audio sampling rate requirements. The module includes a built-in 24MHz crystal and 16Mbit Flash required by XU316 for storing audio firmware.
- A316-1926V1 provides a USB Audio device with USB 2.0 interface compatible with both Full-speed and High-speed modes. In USB 2.0 asynchronous mode, it supports sampling rates up to 768 KHz.
- Combined with different firmware, A316-1926V1 can process up to 6 channels of SPDIF high-definition audio and 2 channels of I2S high-definition audio signals, meeting the requirements of various high-definition audio decoders.
1.2 Product Features¶
- Hardware Configuration
- Integrates high-precision DC-DC chip; module requires only 3.3V external power supply
- Integrates 45.158MHz and 49.152MHz active crystals to meet HiFi application requirements
- Integrates 16Mbit QSPI Flash for firmware and data storage
- USB Interface Features
- USB 2.0 (Full-speed and High-speed)
- USB Audio Class 1.0
- USB Audio Class 2.0
- System Compatibility
- UAC 2.0 protocol, supports ASIO, compatible with multiple operating systems including Windows, Linux, Android, macOS and iOS
1.3 Product Block Diagram¶
1.4 Specifications¶
| Specification Item | Description |
|---|---|
| Product Name | A316-1926-V1 |
| Product Description | USB HiFi Decoder Dedicated XU316 Module |
| Clock | 48.152MHz/49.152MHz Active Crystal Oscillator |
| Package Type | SMT Castellated Holes |
| Environmental Compliance | All hardware components fully comply with EU RoHS directive |
1.5 Absolute Maximum Ratings¶
| Parameter | Minimum | Maximum | Unit |
|---|---|---|---|
| Storage Temperature | -40 | 125 | ℃ |
| Supply Voltage | -0.5 | 3.63 | V |
| ESD Voltage (Human Body Model) TAMB-25℃ | -2 | 2 | KV |
| ESD Voltage (Machine Model) TAMB-25℃ | -500 | 500 | V |
1.6 Normal Operating Conditions¶
| Function | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|
| Operating Temperature | 0 | - | 70 | ℃ |
| Operating Voltage | 3 | 3.3 | 3.6 | V |
1.7 Operating Current¶
| Operating State | Average | Peak | Unit |
|---|---|---|---|
| Active@3.3V | 120 | 200 | mA |
2. Pin Definition¶
2.1 Pin Layout¶
2.2 Pin Description¶
| Module Pin Number | Name | Type | Function |
|---|---|---|---|
| 1 | GND | P | Module Ground |
| 2 | 3V3 | P | Module 3.3V Power Supply |
| 3 | X1D11 | I/O | Multi-function GPIO/XU316 Internal Clock Output |
| 4 | X1D10 | I/O | Multi-function GPIO |
| 5 | X1D09 | I/O | Multi-function GPIO |
| 6 | X1D01 | I/O | Multi-function GPIO |
| 7 | X1D00 | I/O | Multi-function GPIO |
| 8 | X0D11 | I/O | Multi-function GPIO |
| 9 | X0D00 | I/O | Multi-function GPIO |
| 10 | X0D31 | I/O | Multi-function GPIO |
| 11 | X0D30 | I/O | Multi-function GPIO |
| 12 | X1D34 | I/O | Multi-function GPIO |
| 13 | X0D43 | I/O | Multi-function GPIO |
| 14 | X0D41 | I/O | Multi-function GPIO |
| 15 | X0D42 | I/O | Multi-function GPIO |
| 16 | MCLK | I/O | Module 49.152/45.1584MHz Crystal Clock Output |
| 17 | X0D40 | I/O | Multi-function GPIO |
| 18 | X0D38 | I/O | Multi-function GPIO |
| 19 | X0D37 | I/O | Multi-function GPIO |
| 20 | X0D36 | I/O | Multi-function GPIO |
| 21 | X0D35 | I/O | Multi-function GPIO |
| 22 | X0D29 | I/O | Multi-function GPIO |
| 23 | X1D22 | I/O | Multi-function GPIO |
| 24 | X1D19 | I/O | Multi-function GPIO |
| 25 | X1D16 | I/O | Multi-function GPIO |
| 26 | USB_DP | I/O | USB_DP |
| 27 | USB_DM | I/O | USB_DM |
| 28 | X1D18 | I/O | Multi-function GPIO |
| 29 | X1D17 | I/O | Multi-function GPIO |
| 30 | X1D13 | I/O | Multi-function GPIO |
3. Module Dimensions and PCB Footprint¶
3.1 Module Dimensions¶
PCB Dimensions:
19.5±0.3mm(L)X26±0.3mm(W)X0.8±0.1mm(H)
3.2 Module Footprint Diagram¶
4. Product Packaging Information¶
Tray + Outer Box Packaging
5. Recommended Reflow Soldering Temperature Profile¶
6. Revision History¶
| Version | Date | Description | Revised by |
|---|---|---|---|
| V1.0 | 2023-13-12 | Initial Release | |
| V1.1 | 2025-05-07 | Removed software-related feature descriptions | |
7. Consultation & Feedback¶
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